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glue(Interior tiles) - List of Manufacturers, Suppliers, Companies and Products

glue Product List

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Heat Resistance Grade

Heat Resistance Grade

It is ideal for high temperature and heat-resistant applications.

- Suitable for various applications in high-temperature environments. For Any High Temp Operating Devices. High Tg, Low Out Gas, Reflow Resistant, Environmental Resistance Uniq Characters: High Tg, Low absorption, Low Outgas, Reflow Resistant Direct contact information for Nichimoly HP If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

  • Pack-4.JPG
  • Other electronic parts
  • Other Auto Parts
  • Other motors

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Interconnection Conductive Adhesive Silver Epoxy

Interconnection Conductive Adhesive Silver Epoxy

Adhesives for interconnection of various sizes and types of die attach and modules.

We provide conductive adhesives for die bonding of small to large IC chips and for module interconnection. We have prepared a lineup for improved workability and different application methods. Our NIC BOND is used for all sizes of IC bonding and module interconnection. For LED chips, for X-ray image ICs, for RFID, for IC card modules. Use methods: metal mask printing, dispensing, stamping. Direct contact information for Nichimori HP: If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

  • 導電性シリンジ.jpg
  • Chip type LED
  • Dedicated IC
  • IC tag

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Adhesive for Hard Disk Drives

Adhesive for Hard Disk Drives

It demonstrates high reliability in the assembly of hard disk drives.

This is an adhesive with a long track record in hard disk drive assembly. Characteristics: Low outgassing, low-temperature curing, oil-resistant, halogen-free. NIC BOND (part number): NB3040 (two-component), NB3041B (one-component) Syringe, TNB-6322HF. High Quality High Performance for HDD Drive Assembly. Characteristic: Halogen Free, Low Out Gas, Low Temp Cure, Oil Resistant. For direct inquiries to Nichimoly HP, if you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html.

  • NB1001(1).jpg
  • Other motors
  • Optical Connector
  • Other electronic parts

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[Market Report] Global Curing Agent Market

[Market Report] Global Curing Agent Market

The global hardener market is expected to reach 22 billion USD by 2031.

The global curing agent market continues to experience significant growth, with revenues reaching approximately 12 billion USD in 2022. According to recent market research, the market is expected to achieve a robust compound annual growth rate (CAGR) of 7% during the forecast period. From 2023 to 2031, it is projected to ultimately reach 22 billion USD by 2031. The global curing agent market is poised for continuous expansion in the coming years due to rapid industrialization, infrastructure development, and technological advancements. As industries aim to improve product quality, efficiency, and sustainability, the demand for high-performance curing agents is expected to remain strong, driving market growth and innovation. For application methods, please check the [PDF download] button or apply directly through the related links.

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